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This company develops ultra-fine laser technology to help improve the yield of Micro LED

According to Korean media reports, on the 17th, a medium-sized company called Laser apps announced that after four years of research and development, it has developed a Micro LED core process technology: ultra-fine laser technology, for the side wiring process of thin glass substrates. It is very important, it is expected to improve the yield of Micro LED and accelerate the commercialization of Micro LED.


Laser apps mentioned that in the production process of Micro LED, there is a risk of separation when thin glass substrates are attached, and because the wiring of the substrate is difficult, the shortcomings are obvious. Based on this, Laser apps developed a proprietary laser technology, which significantly improved the process problems of Micro LED.



According to reports, the prior art is prone to the risk of damaging the wiring and coating of the glass substrate due to the heat generated during the cutting process. Laser apps minimize the thermal effect, and at the same time, there are no micro-cracks when cutting the TFT glass substrate, which solves the problems of the prior art and therefore eliminates the need for subsequent processing processes such as grinding.


At the same time, the laser technology of Laser apps can accurately cut the glass substrate with the deviation controlled within 10μm, thereby solving the separation problem that may occur when the substrate is attached. Laser apps pointed out that by attaching several small-sized substrates, the size of the Micro LED display can be adjusted freely. If the display is damaged, only the substrate needs to be replaced.


In addition, the technology of Laser apps can also ensure that 3D graphics are accurately printed on the side of the glass substrate, which greatly reduces the difficulty of Micro LED wiring. Normally, in order to print 3D graphics on the side of the glass substrate in general laser technology, the laser beam must irradiate the top, bottom and sides (three times in total), while the laser beam of Laser apps laser technology only needs to irradiate once. In other words, the process time is reduced from 50 minutes to 5 minutes.


In general, the new technology of Laser apps has three advantages: realize the side wiring through 10μm ultra-fine laser technology; solve the separation problem of the glass substrate; and shorten the printing time of 3D graphics from 50 minutes to 5 minutes.


At present, Laser apps has obtained a patent for this technology and has developed a corresponding Micro LED side wiring laser device, which is expected to achieve the effect of 10 μm line width.


Laser apps said that ultra-fine laser technology is suitable for glass substrates and ultra-thin glass substrates. From an application point of view, in addition to the display field, this technology is also applicable to other application fields including semiconductors.